Rekall Incorporated@piefed.socialM to Hardware@lemmy.worldEnglish · 3 个月前Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneckwww.tomshardware.comexternal-linkmessage-square0linkfedilinkarrow-up123arrow-down11file-text
arrow-up122arrow-down1external-linkIntel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneckwww.tomshardware.comRekall Incorporated@piefed.socialM to Hardware@lemmy.worldEnglish · 3 个月前message-square0linkfedilinkfile-text
